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公司产品

SC-FC4545AA Blue LED Chip
产品概述

1. Product Name:  SC-FC4545AA                                


2. Features: 

(1) High radiant flux.

(2) Long operation life.

(3) Excellent Reliability.

(4) Lighting / Backlighting applications.


3. Physical Characteristics: 

(1) Size:

Chip size: 1145±25 μm × 1145±25 μm

Chip thickness: 150±10 μm

P bonding pad: 1060±10 μm × 430±10 μm

N bonding pad: 1060±10 μm × 430±10 μm

(2) Metallization:

P electrode: Au alloy

N electrode: Au alloy

(3) Structure:

Refer to the drawing.


4. Electro-Optical Characteristics (Ta=25oC):

Parameter

Symbol

Condition

Min.

Typ.

Max.

Unit

Forward Voltage

VF1

IF = 700 mA

2.9

3.1

3.3

V

VF4

IF = 1μA

2.0

-

-

V

Reverse Current

IR

VR = 5 V

-

-

1

μA

Dominant Wavelength

λd

IF = 700 mA

445

-

465

nm

Spectra Half Width

λH

IF = 700 mA

-

22

-

nm

Light Output Power

PO

IF = 700 mA

900

-

-

mW

Note:

(1) ESD protection during chip handling is strongly recommended.

(2) All measurements are done on chip form with SINO CRYSTAL’s standard testing equipment.

(3) Dominant wavelength measurement allows a tolerance of ±1nm.

(4) Radiant flux measurement allows a tolerance of ±5%.

(5) Customer’s special requirements are also welcome.


5. Absolute Maximum Ratings:

Parameter

Symbol

Condition

Rating

Unit

Forward DC Current

IF

T= 25oC

≤1000

mA

Reverse Voltage

VR

T= 25oC

≤5

V

Junction Temperature

Tj

-

≤120

oC

Storage Temperature

Tstg

Chip

 -40~85

oC

Chip-on-tape / Storage

5~35

oC

Chip-on-tape / Transportation

-20~65

oC

Temperature during Packaging

-

-

260 (<5sec)

oC


6. Characteristic Curves:

blob.png

blob.png

blob.png


SC-FC4545AA Blue LED Chip

产品概述

1. Product Name:  SC-FC4545AA                                


2. Features: 

(1) High radiant flux.

(2) Long operation life.

(3) Excellent Reliability.

(4) Lighting / Backlighting applications.


3. Physical Characteristics: 

(1) Size:

Chip size: 1145±25 μm × 1145±25 μm

Chip thickness: 150±10 μm

P bonding pad: 1060±10 μm × 430±10 μm

N bonding pad: 1060±10 μm × 430±10 μm

(2) Metallization:

P electrode: Au alloy

N electrode: Au alloy

(3) Structure:

Refer to the drawing.


4. Electro-Optical Characteristics (Ta=25oC):

Parameter

Symbol

Condition

Min.

Typ.

Max.

Unit

Forward Voltage

VF1

IF = 700 mA

2.9

3.1

3.3

V

VF4

IF = 1μA

2.0

-

-

V

Reverse Current

IR

VR = 5 V

-

-

1

μA

Dominant Wavelength

λd

IF = 700 mA

445

-

465

nm

Spectra Half Width

λH

IF = 700 mA

-

22

-

nm

Light Output Power

PO

IF = 700 mA

900

-

-

mW

Note:

(1) ESD protection during chip handling is strongly recommended.

(2) All measurements are done on chip form with SINO CRYSTAL’s standard testing equipment.

(3) Dominant wavelength measurement allows a tolerance of ±1nm.

(4) Radiant flux measurement allows a tolerance of ±5%.

(5) Customer’s special requirements are also welcome.


5. Absolute Maximum Ratings:

Parameter

Symbol

Condition

Rating

Unit

Forward DC Current

IF

T= 25oC

≤1000

mA

Reverse Voltage

VR

T= 25oC

≤5

V

Junction Temperature

Tj

-

≤120

oC

Storage Temperature

Tstg

Chip

 -40~85

oC

Chip-on-tape / Storage

5~35

oC

Chip-on-tape / Transportation

-20~65

oC

Temperature during Packaging

-

-

260 (<5sec)

oC


6. Characteristic Curves:

blob.png

blob.png

blob.png


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